Intel co-founder's 1965 prophecy comes true Packaging could help Intel get back some of its onetime lead. A $ 52.7 billion chipmaking subsidy from the US government won't help until 2023. Even as it spends tens of billions of dollars on new chipmaking capacity, though, its most recent quarterly financial results were "disastrous," TechInsights analyst Linley Gwennap said.
(TSMC), which makes Apple chips, and to Samsung. It's struggling to reclaim chipmaking leadership lost to Taiwan Semiconductor Manufacturing Co. Intel calls this advanced packaging method Foveros. Intel's 2023 Meteor Lake processor includes four data processing "chiplets" on a top layer linked with a communications layer below. The advancement will lead to faster, more powerful computers without an eye-popping price tag. Meteor Lake brings packaging to the mainstream PC market, where consumers buy hundreds of millions of machines annually, even in bad years.
The technology is how AMD builds its top-end PC processor, the Ryzen 7 5800X3D, and how Apple glues two M1 Max chips into the M1 Ultra, its most powerful Mac processor.īut that Ryzen chip retails for $440, and the M1 Ultra adds $2,000 to the price of an M1 Max Mac Studio. It's a crucial element to two new processors: Meteor Lake, a next-generation Core processor family member that'll power PCs in 2023, and Ponte Vecchio, the brains of what's expected to be the world's fastest supercomputer, Aurora.Īdvanced packaging, which lets chip designers link several "chiplets" into one larger processor, is key to making future PCs faster and more capable. Now Intel believes another dimension is as big a deal: how artfully a group of such chips can be packaged into a single, more powerful processor.Īt the Hot Chips conference Monday, Intel Chief Executive Pat Gelsinger shined a spotlight on the company's packaging prowess. For decades, you could test a computer chip's mettle by how small and tightly packed its electronic circuitry is.
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